GB/T 33140-2016
ActivePhosphorized copper anode used for integrated circuit
集成电路用磷铜阳极
Application Summary AI generated
GB/T 33140-2016 specifies the technical requirements, test methods, inspection rules, and packaging for phosphorized copper anodes used in the electroplating process of integrated circuit manufacturing. It is applied in the semiconductor industry to ensure the purity, phosphorus content uniformity, and dimensional precision of copper anodes, which are critical for achieving defect-free copper interconnects in advanced IC packaging and wafer-level metallization. The standard is used by copper anode producers and IC fabrication facilities to control material quality and process consistency.
Related Standards
GB/T 8888-2003
Wrought heavy non-ferrous metal products--Packing，marking，transporting and storing
GB/T 5231-2001
Wrought copper and copper alloys chemical composition limits and forms of wrought products
GB/T 17684-1999
The terminology for precious metals and their alloys
GB/T 1175-1997
Casting zinc alloys
GB/T 16746-1997
Zinc alloy castings
GB/T 16475-1996
Temper designation system for wrought aluminiumand aluminium alloy
GB/T 16474-1996
Wrought aluminium and aluminium alloy--Designation system
GB/T 15676-1995
Terms for rare earths
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.